Sand Blasting Automation for Sputter Carrier Handling Using Two Yaskawa Robots

#SandBlasting#SurfaceTreatment#SputterCarrier#SemiconductorAutomation#YaskawaRobot#HeavyHandling#DustControl#WorkEnvironmentImprovement

Process Overview

This automation solution uses two Yaskawa robots with pneumatic grippers to handle semiconductor sputter carriers and automate the sand blasting process.

Due to the long shape and heavy weight of the workpiece, the handling task previously required two operators, and the workplace environment was harsh due to dust generated during the sanding process.

By automating the entire workflow from handling to sanding through robotic automation, the solution unmanned the key process and significantly improved the operator working environment.

Components

Robot	Yaskawa MH180 x 2 units (1 for loading, 1 for sanding process) 6-axis articulated robot Payload: 180 kg Working range: 2,702 mm Weight: 970 kg Repeatability: ±0.2 mm
Peripherals	Tool: loading robot pneumatic gripper Tool: sanding process robot sand blasting tool, dust collector Peripheral devices: robot mounting base x 2 units Workpiece infeed/outfeed rack Sanding fixing jig Safety fence

Workflow

STEP 1.	Load workpiece onto the rack
STEP 2.	Loading robot picks and places onto sanding fixing jig
STEP 3.	Perform sanding operation
STEP 4.	Loading robot picks and flips orientation, then re-loads onto sanding fixing jig
STEP 5.	Perform sanding operation for the opposite side
STEP 6.	Loading robot unloads finished product and transfers to the rack

※ The content provided by Marosol is protected under U.S. and Canadian copyright and intellectual property laws. Unauthorized reproduction, distribution, or use of this content is strictly prohibited.

Key Features

Creates the most suitable configuration for improving the working environment
Separates operators from the work area by automating the full process, including workpiece loading and sanding
Improves workforce allocation efficiency by automating key processes
Minimizes management points by automating loading, 1st sanding, flipping, 2nd sanding, and unloading in one flow
Maximizes productivity as much as possible
Minimizes idle time through continuous production enabled by robotic automation
Enables optimized tool design and manufacturing based on process conditions and performance requirements
Minimizes failure rates through pre-validation
Enables pre-validation of interference and operational performance through offline simulation

Implementation Results

ROI Period	24 months
Key Metrics	Improved working environment Increased workforce allocation efficiency and productivity by eliminating key processes
Client Feedback	The work environment was extremely harsh and operators avoided the task, but through automation, worker satisfaction improved.

Sand Blasting Automation for Sputter Carrier Handling Using Two Yaskawa Robots

Implementing Company: Please log in to view

Estimated Project Duration: 0week

Robot Model: -

Process Overview

This automation solution uses two Yaskawa robots with pneumatic grippers to handle semiconductor sputter carriers and automate the sand blasting process.

Due to the long shape and heavy weight of the workpiece, the handling task previously required two operators, and the workplace environment was harsh due to dust generated during the sanding process.

By automating the entire workflow from handling to sanding through robotic automation, the solution unmanned the key process and significantly improved the operator working environment.

Components

Workflow

Key Features

Implementation Results

Sand Blasting Automation for Sputter Carrier Handling Using Two Yaskawa Robots

Recommended Use Cases