Semiconductor Material Polishing using Doosan M1509

Industry > Semiconductor·DisplayApplication > Deburring·Post-processingSector > Manufacturing

This machine tending solution utilizes the Doosan M1509 collaborative robot to automate the hazardous and physically demanding task of polishing the surfaces of heavy semiconductor materials. The project was initiated to improve operational efficiency by reassigning workers to higher-value tasks and to enhance customer trust through consistent schedule and quality management.

Previously, manual polishing caused significant strain on workers' wrists and exposed them to high levels of dust, leading to high turnover and a lack of specialized expertise. This inconsistency in the workforce often resulted in fluctuating product quality. By implementing this automation, the robot performs the entire polishing cycle—including the mandatory replacement of one-time-use polishing pads—ensuring uniform quality while allowing operators to simply load raw materials and collect finished goods.

Components

Robot	Robot: Doosan M1509 (M-Series) Type: 6-axis articulated collaborative robot Features: Equipped with 6 high-performance torque sensors (one in each joint) for advanced force control. Payload: 15kg Reach: 900mm Weight: 32kg Repeatability: ±0.05mm

Workflow

STEP 1.	Infeed: Raw materials are fed into the system.
STEP 2.	Picking: The M1509 picks up the heavy semiconductor material.
STEP 3.	Transit: Moves the material to the polishing station.
STEP 4.	Polishing: Executes the primary surface polishing.
STEP 5.	Multi-axis Polishing: Changes orientation to polish the top, bottom, and side surfaces.
STEP 6.	Outfeed: Places the finished product on the discharge table.
STEP 7.	Pad Replacement: Automatically replaces the one-time-use polishing pad.
STEP 8.	Cycle Repeat: Returns to Step 1 for the next workpiece.

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Features

Improved Work Environment for Avoided Tasks

Ergonomic Relief: Eliminates wrist-related musculoskeletal disorders caused by repetitive, high-reaction-force polishing motions.
Health & Safety: Removes human operators from hazardous environments filled with fine process dust.

Guaranteed Operational Safety & Quality

High-Sensitivity Sensing: Equipped with 6-axis torque sensors featuring a 0.2Nm resolution, allowing the robot to detect and react to subtle collisions from any direction for maximum safety.
Precision Force Control: Maintains the optimal reaction force according to external load conditions, ensuring uniform polishing quality across the workpiece.
High-Payload Capability: Utilizes a 15kg high-payload cobot to handle heavy semiconductor materials and high-torque polishing tools effortlessly.
Consistent Quality: Minimizes quality fluctuations caused by high personnel turnover, ensuring professional-grade results through standardized automation.

Compact Installation

Space Efficiency: The streamlined design of the collaborative robot minimizes the footprint required for installation, allowing it to fit into existing production lines without major layout changes.

Results

ROI Period	24 months
Key Benefits	Increased job satisfaction through the strategic reassignment of workers to higher-value tasks. Reduced worker fatigue by eliminating simple, repetitive manual labor. Boosted productivity through continuous 24/7 production and stabilized quality.
Client Feedback	Polishing was the task our workers avoided most due to the poor environment. Replacing it with a robot has significantly increased overall employee satisfaction.