This machine tending solution utilizes the Doosan M1509 collaborative robot to automate the hazardous and physically demanding task of polishing the surfaces of heavy semiconductor materials. The project was initiated to improve operational efficiency by reassigning workers to higher-value tasks and to enhance customer trust through consistent schedule and quality management.
Previously, manual polishing caused significant strain on workers' wrists and exposed them to high levels of dust, leading to high turnover and a lack of specialized expertise. This inconsistency in the workforce often resulted in fluctuating product quality. By implementing this automation, the robot performs the entire polishing cycle—including the mandatory replacement of one-time-use polishing pads—ensuring uniform quality while allowing operators to simply load raw materials and collect finished goods.
Components
| Robot |
|
|---|
Workflow
| STEP 1. | Infeed: Raw materials are fed into the system. |
|---|---|
| STEP 2. | Picking: The M1509 picks up the heavy semiconductor material. |
| STEP 3. | Transit: Moves the material to the polishing station. |
| STEP 4. | Polishing: Executes the primary surface polishing. |
| STEP 5. | Multi-axis Polishing: Changes orientation to polish the top, bottom, and side surfaces. |
| STEP 6. | Outfeed: Places the finished product on the discharge table. |
| STEP 7. | Pad Replacement: Automatically replaces the one-time-use polishing pad. |
| STEP 8. | Cycle Repeat: Returns to Step 1 for the next workpiece. |
※ The content provided by Bigwave Robotics is protected under U.S. and Canadian copyright and intellectual property laws. Unauthorized reproduction, distribution, or use of this content is strictly prohibited.
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This machine tending solution utilizes the Doosan M1509 collaborative robot to automate the hazardous and physically demanding task of polishing the surfaces of heavy semiconductor materials. The project was initiated to improve operational efficiency by reassigning workers to higher-value tasks and to enhance customer trust through consistent schedule and quality management.
Previously, manual polishing caused significant strain on workers' wrists and exposed them to high levels of dust, leading to high turnover and a lack of specialized expertise. This inconsistency in the workforce often resulted in fluctuating product quality. By implementing this automation, the robot performs the entire polishing cycle—including the mandatory replacement of one-time-use polishing pads—ensuring uniform quality while allowing operators to simply load raw materials and collect finished goods.
Components
| Robot |
|
|---|
Workflow
| STEP 1. | Infeed: Raw materials are fed into the system. |
|---|---|
| STEP 2. | Picking: The M1509 picks up the heavy semiconductor material. |
| STEP 3. | Transit: Moves the material to the polishing station. |
| STEP 4. | Polishing: Executes the primary surface polishing. |
| STEP 5. | Multi-axis Polishing: Changes orientation to polish the top, bottom, and side surfaces. |
| STEP 6. | Outfeed: Places the finished product on the discharge table. |
| STEP 7. | Pad Replacement: Automatically replaces the one-time-use polishing pad. |
| STEP 8. | Cycle Repeat: Returns to Step 1 for the next workpiece. |
※ The content provided by Bigwave Robotics is protected under U.S. and Canadian copyright and intellectual property laws. Unauthorized reproduction, distribution, or use of this content is strictly prohibited.